来源：本站整理 作者：佚名 2006-06-25 15:51:00
|
|
外形图 |
封装说明 |
|
|
|
AC'97
v2.2 specifICation
|
|
|
|
AGP 3.3V
ACCelerated Graphics Port
Specification 2.0
|
|
|
|
AGP PRO
Accelerated Graphics Port PRO
Specification 1.01
|
|
|
|
AGP
Accelerated Graphics Port
Specification 2.0
|
|
|
|
AMR
Audio/Modem Riser
|
|
|
|
BGA
Ball Grid Array
|
|
|
|
BQFP132
|
|
|
|
EBGA 680L
|
|
|
|
LBGA 160L
|
|
|
|
PBGA 217L
Plastic Ball Grid Array
|
|
|
|
SBGA 192L
|
|
|
|
TSBGA 680L
|
|
|
|
C-Bend Lead |
|
|
|
Cerquad
Ceramic Quad Flat PACk
|
|
|
|
CLCC
|
|
|
|
CNR
Communication and Networking Riser Specification Revision 1.2
|
|
|
|
CPGA
Ceramic PIN Grid Array |
|
|
|
Ceramic Case
|
|
|
|
LAMINATE CSP 112L
Chip Scale Package
|
|
|
|
DIP
Dual Inline Package
|
|
|
|
DIP-tab
Dual Inline Package with Metal Heatsink |
|
|
|
DIMM 168
|
|
|
|
DIMM DDR
|
|
|
|
DIMM168
Dual In-line Memory Module
|
 |
|
DIMM184
For DDR SDRAM Dual In-line Memory Module
|
 |
|
EISA
Extended ISA
|
|
|
|
FBGA |
|
|
|
FDIP | |
